Request Form

If you already have specific specification requests, please fill in the form. Our staff will contact you shortly. Thank you!

*Email
*Where did you know about IisC?
*Company Name
*Tax Number
*Name/Title
*Industry/Field
*Market Description
*Company/Brand Story
*3-5 year Operation Plans
*Product Name
*Application Areas
*Development Progress
*Functions
Prototype photo

File must be smaller than 10 MB
Acceptable file extensions: .jpg / .jpeg / .png / .gif / .bmp / .webp

*Product story/Origins

Please fill in the following specs requirements to receive faster assistance and services.

*Technology/service Request Assessment
Circuit design
Firmware development
Software development
Multi-function integration technology
SiP technology
Wireless communication technology
Flexible Substrate technology
Micro-display technology
Sensing technology
Power supply technology
Shuttle service
Mechanical design
Industrial design
Field Verification
Others
*Request Description
*Functional Block Diagram

File must be smaller than 10 MB
Acceptable file extensions: .jpg / .jpeg / .png / .gif / .bmp / .webp

MCU:
Low Power
8-bit
16-bit
32-bit
Others
High Energy Efficiency
8-bit
16-bit
32-bit
Others
Brand Issues: Yes:
None
Sensor Module (specs/requirements/brand):
Electricity:
Temperature:
Humidity:
Atmospheric pressure:
Accelerometer:
Gyroscope:
Heart beat & blood oxygen:
Ultraviolet ray:
PM2.5:
CMOS Image sensor:
Gas transducer:
ECG:
EMG:
Respiration:
G-Sensor:
Pressure:
Vibration:
Others:
Wireless Communication:
BLE
Wi-Fi
ZigBee
LoRa
NB-IoT
4G/5G
Others
Brand Issues: Yes:
None
Power:
3.3V DC
5V DC
12V DC
Others
Battery Module:
General battery
Flexible battery
Others
3.3V
5V
Others
10~50mAh
50~200mAh
200~500mAh
Others
Display Module:
LCD
PMOLED
epaper
micro-LED
Others
Brand Issues: Yes:
None
System-level SiP Services:
Reduce module circuit area/size
Reduce packaging thickness
Packaging process (wire bonding, flip chip, ball mount,SMT,Bumping/RDL)
Others
Substrate Material (Flexible Substrate):
Copper foil substrate
PI
PEN
PET
Stretchable substrate (PU/TPU)
Others
Layers of Flexible Substrates (Flexible Substrate):
One layer
Two layers
Three layers
Over four layers
Others
Shuttle service(multi-project wafer, MPW):
Yes
None
*Field Verification Service Requests
Field linking
Product verification
Data platform
Data platform
None
*Suitable Fields for Product
Smart healthcare
Smart exercise & recreation
Smart body sensor technology
Smart Automobile-electronical
Smart manufacturing
Others
Product Advantages
Do you have finished products for field verification?
Yes
None
Transmission method of product signals
BLE
Wi-Fi
Zigbee
NB-IOT
Others
Empirical trial content planned to be done on product
Do you have partner system companies?
Yes
None