Advanced Technologies

SiP( System in Package)
/SiM (System in Module)
Process-related services such as SiP, SiM packaging structure, electrical property, heat transfer, stress design analysis and production, fan out, WLCSP/stacking , component internal setting, etc.
FPC(Flexible Printed Circuit) Hardware specs, element characteristic simulation and measurement
Wafer sensor element system integration
Customized wafer evaluation and design assistance
FPC(Flexible Printed Circuit)