Advanced Technologies

SiP( System in Package)
/SiM (System in Module)
Process-related services such as SiP, SiM packaging structure, electrical property, heat transfer, stress design analysis and production, fan out, WLCSP/stacking , component internal setting, etc.
FPC(Flexible Printed Circuit) Hardware specs, element characteristic simulation and measurement
Wafer sensor element system integration
Customized wafer evaluation and design assistance
FPC(Flexible Printed Circuit)
Smart AIoT Applications AIoT Structure Introduction and Integration Evaluation
AI Model Optimization and Deployment